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Compute.
At a new scale.

Infrastructure for the next generation of high-density, liquid-cooled computing. From a single node to a 600 MW campus.

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01Components
Every part engineered for density
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Conceptual visualization. Configurations shown are representative.
High-density compute Direct-to-chip liquid cooling Modular campus

Campus

600 MW

Phased build-out with hot-aisle containment and on-site substation.

Cooling

PUE 1.12

Direct-to-chip liquid cooling on every rack, closed loop, zero water draw.

Density

200 kW

Per rack, designed for the next generation of accelerators.